Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs)

Published 2020 View Full Article

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Title
Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs)
Authors
Keywords
IGBT, Metal foam, Pin-fin structure, Liquid cooling, Thermal management, Electric vehicle
Journal
APPLIED THERMAL ENGINEERING
Volume 173, Issue -, Pages 115230
Publisher
Elsevier BV
Online
2020-03-21
DOI
10.1016/j.applthermaleng.2020.115230

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