Evaluation of creep properties for Sn–Ag–Cu micro solder joint by multi-temperature stress relaxation test

Published 2012 View Full Article

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Title
Evaluation of creep properties for Sn–Ag–Cu micro solder joint by multi-temperature stress relaxation test
Authors
Keywords
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Journal
MICROELECTRONICS RELIABILITY
Volume 52, Issue 7, Pages 1435-1440
Publisher
Elsevier BV
Online
2012-03-09
DOI
10.1016/j.microrel.2012.02.006

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