Spin-dependent electron scattering in cobalt interconnects

An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines

(2019) R. S. Smith et al.   AIP Advances

Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study

(2018) Nicholas A. Lanzillo et al.   APPLIED PHYSICS LETTERS

Sub-100 nm2 Cobalt Interconnects

(2018) Shibesh Dutta et al.   IEEE ELECTRON DEVICE LETTERS

The electrical resistivity of rough thin films: A model based on electron reflection at discrete step edges

(2018) Tianji Zhou et al.   JOURNAL OF APPLIED PHYSICS

Defect and grain boundary scattering in tungsten: A combined theoretical and experimental study

(2018) Nicholas A. Lanzillo et al.   JOURNAL OF APPLIED PHYSICS

A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects

(2018) Tianji Zhou et al.   AIP Advances

Electron Transport Across Cu/Ta(O)/Ru(O)/Cu Interfaces in Advanced Vertical Interconnects

(2018) Nicholas A. Lanzillo et al.   COMPUTATIONAL MATERIALS SCIENCE

Via Resistance Reduction in Advanced Copper Interconnects

(2017) C.-C. Yang et al.   IEEE ELECTRON DEVICE LETTERS

Electronic and structural analysis of ultra-small-diameter metal disilicide nanowires

(2017) Nicholas A. Lanzillo et al.   JOURNAL OF APPLIED PHYSICS

Ab Initio evaluation of electron transport properties of Pt, Rh, Ir, and Pd nanowires for advanced interconnect applications

(2017) Nicholas A. Lanzillo   JOURNAL OF APPLIED PHYSICS

Lower limits of line resistance in nanocrystalline back end of line Cu interconnects

(2016) Ganesh Hegde et al.   APPLIED PHYSICS LETTERS

Reducing Grain-Boundary Resistivity of Copper Nanowires by Doping

(2016) Mathieu César et al.   Physical Review Applied

Electron transport properties of sub-3-nm diameter copper nanowires

(2015) Sarah L. T. Jones et al.   PHYSICAL REVIEW B

Ni doping on Cu surfaces: Reduced copper resistivity

(2014) P. Y. Zheng et al.   APPLIED PHYSICS LETTERS

Pressure-enabled phonon engineering in metals

(2014) N. A. Lanzillo et al.   PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA

Calculated Resistances of Single Grain Boundaries in Copper

(2014) Mathieu César et al.   Physical Review Applied

Discovery of Face-Centered-Cubic Ruthenium Nanoparticles: Facile Size-Controlled Synthesis Using the Chemical Reduction Method

(2013) Kohei Kusada et al.   JOURNAL OF THE AMERICAN CHEMICAL SOCIETY

Aluminum Conducts Better than Copper at the Atomic Scale: A First-Principles Study of Metallic Atomic Wires

(2012) Adam J. Simbeck et al.   ACS Nano

A comparative study of quantum transport properties of silver and copper nanowires using first principles calculations

(2011) Neerav Kharche et al.   JOURNAL OF PHYSICS-CONDENSED MATTER

Effect of O2 adsorption on electron scattering at Cu(001) surfaces

(2010) J. S. Chawla et al.   APPLIED PHYSICS LETTERS

Four-fold magnetic anisotropy in a Co film on MgO(001)

(2010) M.J.M. Pires et al.   JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS

Simulation of grain boundary effects on electronic transport in metals, and detailed causes of scattering

(2010) Baruch Feldman et al.   PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS

Resistivity of thin Cu films coated with Ta, Ti, Ru, Al, and Pd barrier layers from first principles

(2010) Ferdows Zahid et al.   PHYSICAL REVIEW B

Size-Dependent Resistivity in Nanoscale Interconnects

(2009) Daniel Josell et al.   Annual Review of Materials Research

Structure and Magnetic Properties of Co Epitaxial Thin Films Grown on MgO Single-Crystal Substrates

(2009) Y. Nukaga et al.   IEEE TRANSACTIONS ON MAGNETICS

Resistivity of thin Cu films with surface roughness

(2009) Youqi Ke et al.   PHYSICAL REVIEW B

Cubic TaN diffusion barrier for Cu interconnects using an ultra-thin TiN seed layer

(2008) Roy A. Araujo et al.   THIN SOLID FILMS