Reducing Grain-Boundary Resistivity of Copper Nanowires by Doping

Ni doping on Cu surfaces: Reduced copper resistivity

(2014) P. Y. Zheng et al.   APPLIED PHYSICS LETTERS

Grain boundary segregation engineering in metallic alloys: A pathway to the design of interfaces

(2014) D. Raabe et al.   CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE

$RC$ Performance Evaluation of Interconnect Architecture Options Beyond the 10-nm Logic Node

(2014) Serkan Kincal et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Calculated Resistances of Single Grain Boundaries in Copper

(2014) Mathieu César et al.   Physical Review Applied

Grain boundary complexions

(2013) Patrick R. Cantwell et al.   ACTA MATERIALIA

Band offset of GaAs/AlxGa1−xAs heterojunctions from atomistic first principles

(2013) Yin Wang et al.   APPLIED PHYSICS LETTERS

First Principles Simulations of Nanoscale Silicon Devices With Uniaxial Strain

(2013) Lining Zhang et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Simulation of electrical conduction in thin polycrystalline metallic films: Impact of microstructure

(2013) J. M. Rickman et al.   JOURNAL OF APPLIED PHYSICS

Estimation of grain boundary segregation enthalpy and its role in stable nanocrystalline alloy design

(2013) Heather A. Murdoch et al.   JOURNAL OF MATERIALS RESEARCH

Grain Boundary Character Distribution of Nanocrystalline Cu Thin Films Using Stereological Analysis of Transmission Electron Microscope Orientation Maps

(2013) A.D. Darbal et al.   MICROSCOPY AND MICROANALYSIS

Quantum transport theory with nonequilibrium coherent potentials

(2013) Yu Zhu et al.   PHYSICAL REVIEW B

Electronic structure of III-V zinc-blende semiconductors from first principles

(2013) Yin Wang et al.   PHYSICAL REVIEW B

Effect of Interface Phase Transformations on Diffusion and Segregation in High-Angle Grain Boundaries

(2013) T. Frolov et al.   PHYSICAL REVIEW LETTERS

Structural phase transformations in metallic grain boundaries

(2013) Timofey Frolov et al.   Nature Communications

The stabilization of nanocrystalline copper by zirconium

(2012) Mark A. Atwater et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Diffusion and segregation of silver in copperΣ5(310) grain boundary

(2012) Sergiy V. Divinski et al.   PHYSICAL REVIEW B

Quantum Transport Modeling From First Principles

(2012) Jesse Maassen et al.   PROCEEDINGS OF THE IEEE

Identification of a bilayer grain boundary complexion in Bi-doped Cu

(2012) Animesh Kundu et al.   SCRIPTA MATERIALIA

Texture and Grain Boundary Character Distribution in a Thermomechanically Processed OFHC Copper

(2011) Khaled J. Al-Fadhalah   JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME

Grain boundary engineering: historical perspective and future prospects

(2011) Tadao Watanabe   JOURNAL OF MATERIALS SCIENCE

Electron scattering at surfaces and grain boundaries in Cu thin films and wires

(2011) J. S. Chawla et al.   PHYSICAL REVIEW B

Terminating Surface Electromigration at the Source

(2011) Kirk H. Bevan et al.   PHYSICAL REVIEW LETTERS

The Role of a Bilayer Interfacial Phase on Liquid Metal Embrittlement

(2011) J. Luo et al.   SCIENCE

Interfacial Kinetic Engineering: How Far Have We Come Since Kingery's Inaugural Sosman Address?

(2010) Martin P. Harmer   JOURNAL OF THE AMERICAN CERAMIC SOCIETY

Large Discrete Resistance Jump at Grain Boundary in Copper Nanowire

(2010) Tae-Hwan Kim et al.   NANO LETTERS

Surface and grain-boundary scattering in nanometric Cu films

(2010) Tik Sun et al.   PHYSICAL REVIEW B

Resistivity of thin Cu films coated with Ta, Ti, Ru, Al, and Pd barrier layers from first principles

(2010) Ferdows Zahid et al.   PHYSICAL REVIEW B

Survey of computed grain boundary properties in face-centered cubic metals: I. Grain boundary energy

(2009) David L. Olmsted et al.   ACTA MATERIALIA

Size-Dependent Resistivity in Nanoscale Interconnects

(2009) Daniel Josell et al.   Annual Review of Materials Research

Direct detection of grain boundary scattering in damascene Cu wires by nanoscale four-point probe resistance measurements

(2009) Yusuke Kitaoka et al.   APPLIED PHYSICS LETTERS

Resistivity of thin Cu films with surface roughness

(2009) Youqi Ke et al.   PHYSICAL REVIEW B

Texture investigation in the trench depth direction of very fine copper wires less than 100nm wide using electron backscatter diffraction

(2009) Khyoupin Khoo et al.   THIN SOLID FILMS

Five-parameter grain boundary distribution of commercially grain boundary engineered nickel and copper

(2008) V. Randle et al.   ACTA MATERIALIA

Analysis of Al Doping Effects on Resistivity and Electromigration of Copper Interconnects

(2008) S. Yokogawa et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Cu grain growth in interconnects trenches – Experimental characterization of the overburden effect

(2008) V. Carreau et al.   MICROELECTRONIC ENGINEERING

Disorder Scattering in Magnetic Tunnel Junctions: Theory of Nonequilibrium Vertex Correction

(2008) Youqi Ke et al.   PHYSICAL REVIEW LETTERS