Calculated Resistances of Single Grain Boundaries in Copper

Grain boundary composition and conduction in HfO2: An ab initio study

(2013) K.-H. Xue et al.   APPLIED PHYSICS LETTERS

Quantum transport theory with nonequilibrium coherent potentials

(2013) Yu Zhu et al.   PHYSICAL REVIEW B

Quantum Transport Modeling From First Principles

(2012) Jesse Maassen et al.   PROCEEDINGS OF THE IEEE

Low-Σ twist and tilt grain boundaries in cubic materials

(2011) A. Morawiec   JOURNAL OF APPLIED CRYSTALLOGRAPHY

Texture and Grain Boundary Character Distribution in a Thermomechanically Processed OFHC Copper

(2011) Khaled J. Al-Fadhalah   JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME

Grain boundary engineering: historical perspective and future prospects

(2011) Tadao Watanabe   JOURNAL OF MATERIALS SCIENCE

A review of some elements in the history of grain boundaries, centered on Georges Friedel, the coincident ‘site’ lattice and the twin index

(2011) O. B. M. Hardouin Duparc   JOURNAL OF MATERIALS SCIENCE

Electron scattering at surfaces and grain boundaries in Cu thin films and wires

(2011) J. S. Chawla et al.   PHYSICAL REVIEW B

Resistivity dominated by surface scattering in sub-50 nm Cu wires

(2010) R. L. Graham et al.   APPLIED PHYSICS LETTERS

Large Discrete Resistance Jump at Grain Boundary in Copper Nanowire

(2010) Tae-Hwan Kim et al.   NANO LETTERS

Simulation of grain boundary effects on electronic transport in metals, and detailed causes of scattering

(2010) Baruch Feldman et al.   PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS

Surface and grain-boundary scattering in nanometric Cu films

(2010) Tik Sun et al.   PHYSICAL REVIEW B

An ab initio investigation on boundary resistance for metallic grains

(2010) Ben-hu Zhou et al.   SOLID STATE COMMUNICATIONS

Size-Dependent Resistivity in Nanoscale Interconnects

(2009) Daniel Josell et al.   Annual Review of Materials Research

Direct detection of grain boundary scattering in damascene Cu wires by nanoscale four-point probe resistance measurements

(2009) Yusuke Kitaoka et al.   APPLIED PHYSICS LETTERS

Resistivity of thin Cu films with surface roughness

(2009) Youqi Ke et al.   PHYSICAL REVIEW B

Five-parameter grain boundary distribution of commercially grain boundary engineered nickel and copper

(2008) V. Randle et al.   ACTA MATERIALIA