Modeling the diffusion of solid copper into liquid solder alloys

Published 2008 View Full Article

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Title
Modeling the diffusion of solid copper into liquid solder alloys
Authors
Keywords
-
Journal
THIN SOLID FILMS
Volume 517, Issue 5, Pages 1686-1689
Publisher
Elsevier BV
Online
2008-10-16
DOI
10.1016/j.tsf.2008.09.105

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