On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient

Published 2016 View Full Article

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Title
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient
Authors
Keywords
Thermomigration, Metals and alloys, Diffusion, Synchrotron radiation, Finite element method, Intermetallic alloys and compounds
Journal
MATERIALS LETTERS
Volume 172, Issue -, Pages 211-215
Publisher
Elsevier BV
Online
2016-02-20
DOI
10.1016/j.matlet.2016.02.075

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