Characteristics of high-purity Cu thin films deposited on polyimide by radio-frequency Ar/H2 atmospheric-pressure plasma jet

Effect of Hydrogen Reduction on Characteristics of Cu Thin-Films Deposited by RF-Driven Ar/H$_{2}$ Atmospheric Pressure Plasma Jet

(2012) Hisashi Nakahiro et al.   Applied Physics Express

Controlling the Ambient Air Affected Reactive Species Composition in the Effluent of an Argon Plasma Jet

(2012) Stephan Reuter et al.   IEEE TRANSACTIONS ON PLASMA SCIENCE

Spatiotemporally resolved Ar (1s5) metastable measurements in a streamer-like He/Ar atmospheric pressure plasma jet

(2010) Brian L Sands et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Spatially and temporally resolved measurements of argon metastable atoms in the effluent of a cold atmospheric pressure plasma jet

(2010) R Bussiahn et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Study on chemical vapor deposited copper films on cyano and carboxylic self-assembled monolayer diffusion barriers

(2010) Zhe Kong et al.   THIN SOLID FILMS

Generation of room-temperature atmospheric H2/Ar microplasma jet driven with pulse-modulated ultrahigh frequency and its application to gold nanoparticle preparation

(2009) Yoshiki Shimizu et al.   APPLIED PHYSICS LETTERS

Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness

(2008) Bo-In Noh et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Gas temperature, electron density and electron temperature measurement in a microwave excited microplasma

(2008) Xi-Ming Zhu et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Plasma surface treatment of polyimide for adhesive Cu/80Ni20Cr/PI flexible copper clad laminate

(2008) Jun Sun Eom et al.   THIN SOLID FILMS

Enhanced adhesion of plasma-sputtered copper films on polyimide substrates by oxygen glow discharge for microelectronics

(2007) Y.-S. Lin et al.   THIN SOLID FILMS