Plasma surface treatment of polyimide for adhesive Cu/80Ni20Cr/PI flexible copper clad laminate

Title
Plasma surface treatment of polyimide for adhesive Cu/80Ni20Cr/PI flexible copper clad laminate
Authors
Keywords
-
Journal
THIN SOLID FILMS
Volume 516, Issue 14, Pages 4530-4534
Publisher
Elsevier BV
Online
2008-02-07
DOI
10.1016/j.tsf.2008.01.022

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