Carrier-Mobility Enhancement via Strain Engineering in Future Thin-Body MOSFETs

Title
Carrier-Mobility Enhancement via Strain Engineering in Future Thin-Body MOSFETs
Authors
Keywords
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Journal
IEEE ELECTRON DEVICE LETTERS
Volume 33, Issue 3, Pages 318-320
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2012-01-10
DOI
10.1109/led.2011.2179113

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