Comparison of Uniaxial Wafer Bending and Contact-Etch-Stop-Liner Stress Induced Performance Enhancement on Double-Gate FinFETs

Published 2008 View Full Article

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Title
Comparison of Uniaxial Wafer Bending and Contact-Etch-Stop-Liner Stress Induced Performance Enhancement on Double-Gate FinFETs
Authors
Keywords
-
Journal
IEEE ELECTRON DEVICE LETTERS
Volume 29, Issue 5, Pages 480-482
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2008-04-29
DOI
10.1109/led.2008.919791

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