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期刊名
JOURNAL OF ELECTRONIC PACKAGING
J ELECTRON PACKAGING
ISSN / eISSN
1043-7398 / 1528-9044
目标和范围
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
研究方向
工程：电子与电气
工程：机械
CiteScore
4.00
查看趋势图
CiteScore 学科排名
| 类别 | 分区 | 排名 |
|---|---|---|
| Engineering - Mechanics of Materials | Q2 | #150/391 |
| Engineering - Electrical and Electronic Engineering | Q2 | #305/738 |
| Engineering - Computer Science Applications | Q2 | #333/792 |
| Engineering - Electronic, Optical and Magnetic Materials | Q2 | #131/271 |
Web of Science 核心合集
| Science Citation Index Expanded (SCIE) | Social Sciences Citation Index (SSCI) |
|---|---|
| Indexed | - |
| 类别 (Journal Citation Reports 2023) | 分区 |
|---|---|
| ENGINEERING, ELECTRICAL & ELECTRONIC - SCIE | Q4 |
| ENGINEERING, MECHANICAL - SCIE | Q4 |
H-index
46
出版国家或地区
UNITED STATES
出版商
American Society of Mechanical Engineers(ASME)
出版周期
Quarterly
年文章数
77
Open Access
NO
通讯方式
ASME-AMER SOC MECHANICAL ENG, THREE PARK AVE, NEW YORK, USA, NY, 10016-5990
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