Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Ultrathin and Ultrasensitive Printed Carbon Nanotube-Based Temperature Sensors Capable of Repeated Uses on Surfaces of Widely Varying Curvatures and Wettabilities

(2021) Beihan Zhao et al.   ACS Applied Materials & Interfaces

Advanced Nanomaterials, Printing Processes, and Applications for Flexible Hybrid Electronics

(2020) Sehyun Park et al.   Materials

Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications

(2019) Qijin Huang et al.   Advanced Materials Technologies

A review of aerosol jet printing—a non-traditional hybrid process for micro-manufacturing

(2019) N. J. Wilkinson et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Effects of GAS Flow Rates On Quality of Aerosol Jet Printed Traces with Nanoparticle Conducting Ink

(2019) Neil Dalal et al.   JOURNAL OF ELECTRONIC PACKAGING

Life Model of the Electrochemical Migration Failure of Printed Circuit Boards Under NaCl Solution

(2019) Yilin Zhou et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

The Effect of Droplet Sizes on Overspray in Aerosol-Jet Printing

(2018) Guang Chen et al.   ADVANCED ENGINEERING MATERIALS

Design, manufacture and test for reliable 3D printed electronics packaging

(2018) Tim Tilford et al.   MICROELECTRONICS RELIABILITY

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

(2017) Jingshi Meng et al.   JOURNAL OF ELECTRONIC PACKAGING

Online Monitoring of Functional Electrical Properties in Aerosol Jet Printing Additive Manufacturing Process Using Shape-From-Shading Image Analysis

(2017) Roozbeh (Ross) Salary et al.   JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME

Computational Fluid Dynamics Modeling and Online Monitoring of Aerosol Jet Printing Process

(2016) Roozbeh (Ross) Salary et al.   JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME

3D Printing of Shape Memory Polymers for Flexible Electronic Devices

(2015) Matt Zarek et al.   ADVANCED MATERIALS

Analysis of the Kinetics of Electrochemical Migration on Printed Circuit Boards Using Nernst-Planck Transport Equation

(2014) Xiaofei He et al.   ELECTROCHIMICA ACTA

Electrochemical migration of tin in thin electrolyte layer containing chloride ions

(2013) Xiankang Zhong et al.   CORROSION SCIENCE

Reliability Analysis and Accelerated Statistical Model of CNC PCB for Electrochemical Migration

(2013) Chuanning Xie et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Effect of Selected Process Parameters on Durability and Defects in Surface-Mount Assemblies for Portable Electronics

(2008) Leila J. Ladani et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING