IEEE Transactions on Dependable and Secure Computing
Note: The following journal information is for reference only. Please check the journal website for updated information prior to submission.
Journal Title
IEEE Transactions on Dependable and Secure Computing
IEEE T DEPEND SECURE
ISSN / eISSN
1545-5971
Aims and Scope
IEEE Transactions on Dependable and Secure Computing (TDSC) publishes archival research results focusing on research into foundations, methodologies, and mechanisms that support the achievement–through design, modeling, and evaluation–of systems and networks that are dependable and secure to the desired degree without compromising performance. The focus also includes measurement, modeling, and simulation techniques, and foundations for jointly evaluating, verifying, and designing for performance, security, and dependability constraints.
Subject Area
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
COMPUTER SCIENCE, INFORMATION SYSTEMS
COMPUTER SCIENCE, SOFTWARE ENGINEERING
CiteScore
10.40
View Trend
CiteScore Ranking
Category | Quartile | Rank |
---|---|---|
Computer Science - General Computer Science | Q1 | #18/233 |
Computer Science - Electrical and Electronic Engineering | Q1 | #67/738 |
Web of Science Core Collection
Science Citation Index Expanded (SCIE) | Social Sciences Citation Index (SSCI) |
---|---|
Indexed | - |
Category (Journal Citation Reports 2023) | Quartile |
---|---|
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE - SCIE | Q1 |
COMPUTER SCIENCE, INFORMATION SYSTEMS - SCIE | Q1 |
COMPUTER SCIENCE, SOFTWARE ENGINEERING - SCIE | Q1 |
H-index
59
Country/Area of Publication
UNITED STATES
Publisher
Institute of Electrical and Electronics Engineers Inc.
Publication Frequency
Quarterly
Annual Article Volume
290
Open Access
NO
Contact
IEEE COMPUTER SOC, 10662 LOS VAQUEROS CIRCLE, PO BOX 3014, LOS ALAMITOS, USA, CA, 90720-1314
Verified Reviews
First review: 2 minor revisions, 2 rejections, resubmission;
Second review: 2 acceptances, 1 minor revision, 1 rejection, major revision;
Third review: 3 acceptances, 1 rejection (only 1 comment: lack of innovation, outdated comparison methods), major revision; as the innovation cannot be improved, we can only explain with literature and supplement with comparison to 2 other methods. In the response, we mentioned that if the reviewers are not satisfied, please suggest which literature to compare with, and we are willing to include it.
Fourth review, there were only 3 reviewers, 2 acceptances, 1 rejection, and ultimately rejected. The reviewers who rejected in the first 3 rounds rejected again this time. The reviewer who rejected this time was an "invited" reviewer, who raised 3 questions without mentioning our response to the previous rejection. However, these 3 questions were raised by previous reviewers, and we have already responded to and made modifications (he reviewed in the 4th round, probably couldn't see the previous responses). However, all of the authors suspect that it is the Associate Editor's review comments, as they are basically the same as the previous rejection by that expert.
Luck is still needed, it seems difficult without a renowned expert's endorsement.
Submitted on June 15, 2021, the submission was directly placed "Under Review" (according to the journal's website, the submission system only has two statuses: "Under Review" and "With Associate Editor"). On August 4, it changed to "With Associate Editor," and on August 12, the editor-in-chief sent an email stating that two were rejected, two required minor revisions, and the conclusion was to "Revise and Resubmit as New."
Re-submitted on September 25, 2021, on November 18, it changed to "With Associate Editor," and on November 30, the editor-in-chief sent an email stating that one was rejected, one required minor revisions, and two were accepted, concluding that "Major Revisions Required." The email explicitly mentioned that the opportunity for major revisions is the final chance. Generally, the journal only allows one major revision, so "modify and resubmit" seems to refer to the first major revision.
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