Present and future thermal interface materials for electronic devices

标题
Present and future thermal interface materials for electronic devices
作者
关键词
-
出版物
INTERNATIONAL MATERIALS REVIEWS
Volume 63, Issue 1, Pages 1-21
出版商
Informa UK Limited
发表日期
2017-03-27
DOI
10.1080/09506608.2017.1296605

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