Interfacially engineered liquid-phase-sintered Cu–In composite solders for thermal interface material applications

Mechanical and thermal modeling of In-Cu composites for thermal interface materials applications

(2013) Praveen Kumar et al.   JOURNAL OF COMPOSITE MATERIALS

A Stepped-Bar Apparatus for Thermal Resistance Measurements1

(2013) Dakotah R. Thompson et al.   JOURNAL OF ELECTRONIC PACKAGING

Improvement of oxidation resistance of copper by atomic layer deposition

(2012) M.L. Chang et al.   APPLIED SURFACE SCIENCE

Impact of ultrathin Al2O3 diffusion barriers on defects in high-k LaLuO3 on Si

(2011) S. Shen et al.   APPLIED PHYSICS LETTERS

Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications

(2011) J. Liu et al.   JOURNAL OF MATERIALS SCIENCE

On the Field Evaporation Behavior of Dielectric Materials in Three-Dimensional Atom Probe: A Numeric Simulation

(2010) Christian Oberdorfer et al.   MICROSCOPY AND MICROANALYSIS

Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications

(2009) I. Dutta et al.   JOURNAL OF ELECTRONIC MATERIALS