Highly Thermal Conductive Copper Nanowire Composites with Ultralow Loading: Toward Applications as Thermal Interface Materials

出版年份 2014 全文链接

标题

作者

关键词

出版物

Volume 6, Issue 9, Pages 6481-6486

出版商

American Chemical Society (ACS)

发表日期

2014-04-09

DOI

10.1021/am500009p

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