Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications

标题
Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications
作者
关键词
B2O3, Boron Nitride, Thermal Performance, Squeeze Casting, Hexagonal Boron Nitride
出版物
出版商
Springer Nature
发表日期
2014-03-20
DOI
10.1007/s10854-014-1880-8

向作者/读者发起求助以获取更多资源

Reprint

联系作者

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now