标题
Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications
作者
关键词
-
出版物
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume 4, Issue 12, Pages 1906-1913
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2014-11-21
DOI
10.1109/tcpmt.2014.2369371
参考文献
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