Effects of Temperature Cycling and Elevated Temperature/Humidity on the Thermal Performance of Thermal Interface Materials

出版年份 2009 全文链接

标题

作者

关键词

出版物

Volume 9, Issue 3, Pages 379-391

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2009-06-25

DOI

10.1109/tdmr.2009.2025367

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