Thermal resistance of CNTs-based thermal interface material for high power solid state device packages

标题
Thermal resistance of CNTs-based thermal interface material for high power solid state device packages
作者
关键词
Thermal Resistance, Plasma Enhance Chemical Vapor Deposition, Thermal Contact Resistance, Device Under Test, Thermal Interface Resistance
出版物
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
Volume 114, Issue 4, Pages 1145-1152
出版商
Springer Nature
发表日期
2013-04-11
DOI
10.1007/s00339-013-7676-5

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