Article
Engineering, Electrical & Electronic
M. Nasir Bashir, Hafiz Muhammad Saad, Muhammad Rizwan, Sedat Bingol, Iftikhar Ahmed Channa, Mustabshirha Gul, A. S. M. A. Haseeb, Sumsun Naher
Summary: The study aimed to investigate the effects of cobalt nanoparticle concentrations on the tensile properties of Sn-58Bi solder material. The results showed that the addition of Co NP significantly increased the tensile strength of the solder joints. Furthermore, ductility was improved with increasing temperature, but the ultimate tensile strength decreased with longer aging time.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2022)
Article
Materials Science, Multidisciplinary
Jeverton Laureano Paixao, Rai Batista de Sousa, Bruno Silva Sobral, Rubiamara Mauricio de Sousa, Jefferson Romaryo Duarte da Luz, Jose Eduardo Spinelli, Bismarck Luiz Silva
Summary: This study investigates the effects of zinc additions on the properties of Sn-Cu alloys. The results show that zinc can improve the microstructure of the alloy, but has limited impact on the cytotoxicity levels.
MATERIALS CHARACTERIZATION
(2023)
Article
Engineering, Electrical & Electronic
Min Jeong Ha, Jeong Il Lee, Jong-Min Kim, Byung-Seung Yim
Summary: A novel bonding system was proposed to improve the thermal and mechanical limitations of solderable epoxy composites (SECs) with low-melting-point solder (LMS) fillers. Wetting properties of the resulting composite were evaluated by synthesizing different ratios of LMS and high-melting-point solder (HMS). The wetting behavior of the composite was found to depend on the mixing ratio of LMS and HMS.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
M. Nasir Bashir, Niaz Bahadur Khan, Shahid Bashir, Abdul Faheem Khan, M. M. Quazi, Mustabshirha Gul, Saif Wakeel, Hafiz Muhammad Saad
Summary: Migration of Cu atoms from the cathode side to the anode side causes void formation in the solder joint, which is the root cause of electromigration failures in lead-free solder joints. This study investigates the effects of Zn nanoparticle-doped flux on the mechanical properties of SAC305 solder joint under high current density. The results show that the addition of Zn nanoparticle-doped flux improves the mechanical strength of the solder joint and suppresses Cu migration, preventing fracture path shift.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
Zeyu Yuan, Yujie He, Ruize Wu, Ming Xu, Jun Zhang, Yunqing Zhu, Qiaoli Wang, Weibin Xie, Huiming Chen
Summary: In this study, the addition of trace amount of rare earth Tb in Sn-3.5Ag-0.5Cu solder was found to delay the formation of IMCs and result in thinner IMC layers. The addition of 0.025 wt% Tb improved shear strength and wettability, while slowing down IMC growth, thus extending the reliability of the joint interface and the service life of the solder joint.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2022)
Article
Engineering, Electrical & Electronic
M. Tamizi, M. Movahedi, A. H. Kokabi
Summary: The aim of this study is to investigate the effect of dopant particles on the spreadability of composite solder paste during reflow soldering. Graphene NanoSheets (GNSs) without and with cobalt coat (CoGNSs) were added to SAC0307 solder paste, and their spreading behavior was evaluated using a thermo-optic system. The results showed that CoGNSs exhibited superior spreading properties compared to GNSs due to density matching and metallic bonding. The theoretical study explored the mechanisms of interactions between solid particles and melted flux/molten solder during reflow soldering.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
Xi Wang, Liang Zhang, Chen Chen, Xiao Lu, Wei-min Long
Summary: The growth behavior of interfacial intermetallic compounds (IMC) in Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.05AlN/Cu solder joints under ultrasound-assisted soldering processes was investigated. The effects of ultrasonic soldering and AlN nanoparticles on the shear strength of the solder joints were studied. Ultrasonic vibrations can enhance the mechanical properties of the solder joint by increasing nucleation mass and producing uniform and finer grains, while AlN nanoparticles inhibit the diffusion of Cu elements and reduce the growth rate of the interface IMC, leading to increased shear properties of the solder joint.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2023)
Article
Nanoscience & Nanotechnology
S. Q. Li, Q. H. Li, H. J. Cao, X. Z. Zheng, Z. H. Zhang
Summary: In this study, the performance of SnBi solder was improved by adding Cu@Ag core-shell particles, resulting in significant refinement in grain size and intragranular eutectic structures. The modified solder exhibited a shift from brittle fracture mode to a mixed brittle and tough mode, and a 21% increase in tensile strength. Furthermore, the addition of Cu@Ag core-shell particles significantly increased electrical conductivity by forming interconnected high-speed channels for electron migration, and remarkably enhanced thermal conductivity with a value of 41.33 W m-1 K-1. This research addresses the partial property deficiencies of SnBi solder and expands its application in low temperature electronic packaging.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
(2023)
Article
Chemistry, Physical
Minghong Jian, Sa'd Hamasha, Ali Alahmer, Mohammad Hamasha, Xin Wei, Mohamed El Amine Belhadi, Khozima Hamasha
Summary: This study investigates the influence of aging and varying cycles on the fatigue of SnAgCu-Bi (SAC-Bi) solder joints. The results show that aging reduces the fatigue life of the solder joints, especially SAC305. A new fatigue model is proposed that provides a more accurate estimation of damage accumulation by assessing inelastic work amplification.
Review
Engineering, Mechanical
Qilong Guan, Chunjin Hang, Shengli Li, Dan Yu, Ying Ding, Xiuli Wang, Yanhong Tian
Summary: The spacecraft for deep space exploration missions will encounter extreme environments, including cryogenic temperature, intense radiation, wide-range temperature variations, and even a combination of these conditions. The degradation or failure of solder joints in harsh environments can result in damage to onboard electronics. The research on high reliability solder joints in extreme environments can reduce the need for onboard protection devices and improve the overall reliability of spacecraft, which is of great significance to the aviation industry. This paper reviews the reliability research on SnPb solder alloys, Sn-based lead-free solder alloys, and In-based solder alloys in extreme environments, and provides suggestions for future studies focusing on solder joint reliability under extreme environments.
CHINESE JOURNAL OF MECHANICAL ENGINEERING
(2023)
Article
Chemistry, Physical
Francy John Akkara, Sa'd Hamasha, Ali Alahmer, John Evans, Mohamed El Amine Belhadi, Xin Wei
Summary: The study investigates the impact of surface finish on solder joint reliability and combines multiple experimental conditions and commercial alloys to simulate real-world applications. It reveals the critical role of micro and uniformly distributed precipitates for high-reliability solder joints, and the involvement of recrystallization in new grain formation and crack propagation. ENIG surface finish outperforms others but may not be more reliable in all solder paste/sphere/finish combinations.
Article
Polymer Science
Peng Zhang, Songbai Xue, Lu Liu, Jianhao Wang, Hiroaki Tatsumi, Hiroshi Nishikawa
Summary: This study investigated the microstructure evolution and mechanical properties of novel epoxy composite SAC305 solder joints after aging, and found that the epoxy composite joints had a lower growth rate of intermetallic compounds and significantly improved mechanical properties.
Article
Engineering, Electrical & Electronic
Bismarck Luiz Silva, Pedro Henrique Mendes, Amauri Garcia, Jose Eduardo Spinelli
Summary: In addition to intermetallic growth, phase dissolution, and precipitation, the variation in dendritic scale is an important factor to consider in solder joint operations. This study explores the evolution of dendritic array, Ag3Sn spacing, and hardness in the SAC207 alloy under different aging conditions. The research finds that the initial dendritic spacing and cooling rate have a crucial impact on dendritic array coarsening, and the Ag3Sn spacing connected to spheroidal-like particles is more susceptible to coarsening.
JOURNAL OF ELECTRONIC MATERIALS
(2022)
Article
Materials Science, Multidisciplinary
A. F. Abd El-Rehim, D. M. Habashy, H. Y. Zahran, H. N. Soliman
Summary: An artificial neural network (ANN) model was utilized to simulate and predict the mechanical properties of Sn-9Zn-Cu solder alloys, showing consistent results with experimental data, indicating the good accuracy and reliability of the ANN model in predicting alloy hardness.
METALS AND MATERIALS INTERNATIONAL
(2021)
Article
Engineering, Electrical & Electronic
Rai Batista de Sousa, Jeverton Laureano Paixao, Suylan Lourdes de Araujo Dantas, Pamella Raffaela Dantas de Freitas, Jefferson Romaryo Duarte da Luz, Jose Eduardo Spinelli, Bismarck Luiz Silva
Summary: This study investigated the effects of Ni addition on Sn-Ag alloys and found that the addition of Ni improved the cooling and growth rates of the alloy and stabilized the morphology of Ag3Sn intermetallics.
JOURNAL OF ELECTRONIC MATERIALS
(2023)
Review
Engineering, Biomedical
Guy Decante, Joao B. Costa, Joana Silva-Correia, Maurice N. Collins, Rui L. Reis, J. Miguel Oliveira
Summary: Three-dimensional (3D) bioprinting technology has gained significant attention in biomedical engineering and clinical applications, with advancements in bioink development allowing for more precise mimicry of native tissue characteristics and support for biofunctionality.
Article
Chemistry, Applied
Fernanda Zamboni, Chinonso Okoroafor, Michael P. Ryan, J. Tony Pembroke, Michal Strozyk, Mario Culebras, Maurice N. Collins
Summary: Contamination of biomaterials by Staphylococcus aureus is a major issue in clinical settings, with strategies to decrease biofilm-related infections being vital for the success of implantable devices. Utilizing hyaluronic acid (HA) with crosslinking strategies and reinforcing fibres can produce tailored gels with antimicrobial properties. These HA derivatives show excellent mechanical properties and antibacterial effects against Staphylococcus aureus.
CARBOHYDRATE POLYMERS
(2021)
Article
Biochemistry & Molecular Biology
Mario Culebras, Mahboubeh Pishnamazi, Gavin M. Walker, Maurice N. Collins
Summary: The study successfully synthesized hydrogels using lignin, a non-valorized biopolymer, crosslinked with PEGDGE. The ratio of crosslinker used influenced the structural and chemical properties of the resulting hydrogels, with increased crosslinker amount leading to smaller pore size and higher swelling capacity. Paracetamol release test showed higher drug diffusion for hydrogels produced with a lignin:PEGDGE ratio of 1:1.
Article
Chemistry, Multidisciplinary
Leila Keshavarz, Mahboubeh Pishnamazi, U. B. Rao Khandavilli, Saeed Shirazian, Maurice N. Collins, Gavin M. Walker, Patrick J. Frawley
Summary: This study engineered the Particle Size Distribution (PSD) of paracetamol crystals using additives to improve compressibility properties. Cooling crystallization experiments revealed that the cooling rate was the most effective parameter in controlling PSD. By tailoring crystal properties through controlled crystallization, smaller particles were obtained which significantly enhanced the compressibility of paracetamol. Tablets with improved hardness and longer disintegration time were prepared using direct compaction method. Overall, this work demonstrates the potential use of structurally similar compounds as additives to modify the mechanical properties of active pharmaceutical ingredients.
ARABIAN JOURNAL OF CHEMISTRY
(2021)
Review
Biochemistry & Molecular Biology
Patryk Jedrzejczak, Maurice N. Collins, Teofil Jesionowski, Lukasz Klapiszewski
Summary: The construction industry in the 21st century faces increasing global challenges related to environmental concerns. This review focuses on the role of lignin and its derivatives in sustainable construction, which can partially replace petroleum products and make the sector more sustainable. The latest technological developments offer alternative materials for construction with reduced environmental impact, contributing to a more sustainable industry.
INTERNATIONAL JOURNAL OF BIOLOGICAL MACROMOLECULES
(2021)
Article
Materials Science, Biomaterials
Farnaz Ghorbani, Behafarid Ghalandari, Melika Sahranavard, Ali Zamanian, Maurice N. Collins
Summary: The study utilized bioactive glass nanoparticles and polycaprolactone scaffolds for bone tissue engineering, with oxygen plasma activation to immobilize simvastatin for enhanced hydroxyapatite formation. Mathematical modeling revealed that oxygen plasma pre-treatment can modulate simvastatin release profiles from the scaffolds, with release mechanism controlled by the balance between diffusion and erosion mechanisms. Computational modeling suggested Human Serum Albumin and Human alpha 2-macroglobulin can increase simvastatin bioavailability for cells via a molecular docking mechanism.
MATERIALS SCIENCE & ENGINEERING C-MATERIALS FOR BIOLOGICAL APPLICATIONS
(2021)
Article
Green & Sustainable Science & Technology
Hamid Hafizi, Gavin Walker, Maurice N. Collins
Summary: In this study, a novel multifunctional catalyst was prepared for the production of biomass-derived liquid fuel. High efficiency conversion of different substrates was achieved through direct etherification and one-pot reactions, with high reusability and catalytic activity.
Article
Engineering, Manufacturing
Joseph P. Mooney, Vanessa Egan, Ruairi Quinlan, Jeff Punch
Summary: The study investigated the impact of different heat pipe configurations on thermal performance, finding that the combination of MHS, bend angle, and bend location has unique effects on fluid transport mechanisms inside the heat pipe, leading to changes in thermal performance across different configurations.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
(2021)
Article
Chemistry, Multidisciplinary
Jose F. Serrano-Claumarchirant, Ana Maria Igual-Munoz, Mario Culebras, Maurice N. Collins, Andres Cantarero, Clara M. Gomez
Summary: The research focused on the production of a hybrid layered thermoelectric material by electrochemically depositing SnS on a PEDOT electrode to enhance thermoelectric properties. Optimizing the doping level of SnS by adding Ag significantly improved the power factor to 58.6 mu W m(-1) K-2, more than two orders of magnitude higher than undoped materials.
ADVANCED MATERIALS INTERFACES
(2021)
Article
Chemistry, Multidisciplinary
C. Winters, F. Zamboni, A. Beaucamp, M. Culebras, M. N. Collins
Summary: The use of organic materials in biomedical devices for conductivity has gained attention due to their stability, low cost, light weight, and excellent electrical and optical properties. In this study, PEDOT nanoparticles were successfully synthesized using hyaluronic acid as a stabilizer, improving their bioactivity and hydrophilicity. Varying amounts of hyaluronic acid and different molar ratios of EDOT:TOS were found to affect the conductive and morphological properties of the nanoparticles. The nanoparticles demonstrated high conductivity and showed promise for customizable in vivo applications, surpassing the conductivity of pristine PEDOT:PSS. The proposed easy-to-manufacture approach and superior properties of the nanoparticles expand the potential of conductive polymers in future biological applications.
MATERIALS TODAY CHEMISTRY
(2022)
Article
Engineering, Biomedical
Aleksandra Serafin, Mario Culebras Rubio, Marta Carsi, Pilar Ortiz-Serna, Maria J. Sanchis, Atul K. Garg, J. Miguel Oliveira, Jacob Koffler, Maurice N. Collins
Summary: The incorporation of PEDOT NPs into Gel:HA biomaterial scaffolds enhances the conductive capabilities and provides a healing environment for stimulating regeneration in spinal cord injuries.
BIOMATERIALS RESEARCH
(2022)
Article
Materials Science, Composites
Julio Vidal, Carlos Hornero, Ruth Garcia, Jesus Cuartero, Anne Beaucamp, Maurice N. Collins, Lidia Garcia, David Ponce, Mari Carme Royo, Elisabeth Sanchez, Pere Castell
Summary: This research aims to integrate reversible chemistries in advanced carbon fiber-reinforced composites for sustainable recycling. The study shows that diene and dienophile reactions on the fiber surface allow bond-debond interactions with the epoxy matrix, effectively modifying the resin's properties. The newly developed interphase chemistry has a significant impact on the crosslinking efficiency and interlaminar properties of the resin.
POLYMER COMPOSITES
(2023)
Article
Engineering, Biomedical
Mark Sheridan, Caitriona Winters, Fernanda Zamboni, Maurice N. Collins
Summary: Contamination of biomedical products is a major cause of hospital-acquired infections, and the development of antimicrobial biomaterials and surface structures is crucial to reduce infection risks.
CURRENT OPINION IN BIOMEDICAL ENGINEERING
(2022)
Article
Chemistry, Multidisciplinary
Anne Beaucamp, Mario Culebras, Maurice N. Collins
Summary: A third-generation glucose biosensor has been developed using mesoporous carbon nanostructures with glucose oxidase immobilization, allowing for strong and selective activity towards glucose. The biosensor demonstrates high sensitivity and a linear response in glucose detection, with a significantly low limit of detection.
Review
Nanoscience & Nanotechnology
Soraia Lopes, Maurice N. Collins, Rui L. Reis, Joaquim M. Oliveira, Joana Silva-Correia
Summary: This review focuses on vascularization in tissue engineering, discussing the formation of vascular networks within scaffolds and their ability to connect to the patient's vasculature. It also explores the development of angiogenesis techniques and monitoring methods, and how these can be utilized to tailor vascularization in large tissue engineered constructs. Finally, it offers an outlook on vascularization and emerging bioprinting concepts in tissue engineering applications.
ACS APPLIED BIO MATERIALS
(2021)
