Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints

出版年份 2011 全文链接

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作者

关键词

出版物

IEEE Transactions on Components Packaging and Manufacturing Technology

Volume 1, Issue 10, Pages 1583-1593

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2011-09-23

DOI

10.1109/tcpmt.2011.2140109

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IEEE Transactions on Components Packaging and Manufacturing Technology

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