Effect of Pr addition on properties and Sn whisker growth of Sn–0.3Ag–0.7Cu low-Ag solder for electronic packaging

Study on microstructure and properties of Sn–0.3Ag–0.7Cu solder bearing Nd

(2016) Jiachen Xu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Microstructure and Mechanical Properties of Tin-Bismuth Solder Reinforced by Aluminum Borate Whiskers

(2015) Jun Wang et al.   JOURNAL OF ELECTRONIC MATERIALS

Properties enhancement of SnAgCu solders containing rare earth Yb

(2014) Liang Zhang et al.   MATERIALS & DESIGN

Structure and properties of lead-free solders bearing micro and nano particles

(2014) Liang Zhang et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders

(2014) A.A. El-Daly et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Properties and microstructures of SnAgCu– x Eu alloys for concentrator silicon solar cells solder layer

(2014) Liang Zhang et al.   SOLAR ENERGY MATERIALS AND SOLAR CELLS

Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance

(2013) A.A. El-Daly et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

(2012) A.A. El-Daly et al.   MATERIALS & DESIGN

Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder

(2012) L.C. Tsao et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition

(2011) Guang Zeng et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructure characterization of SnAgCu solder bearing Ce for electronic packaging

(2011) Liang Zhang et al.   MICROELECTRONIC ENGINEERING

Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders

(2009) M.A. Dudek et al.   ACTA MATERIALIA

Influence of indium addition on characteristics of Sn–0.3Ag–0.7Cu solder alloy

(2009) Kannachai Kanlayasiri et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates

(2008) Hongqin Wang et al.   JOURNAL OF ELECTRONIC MATERIALS