Interfacial reaction and microstructure between the Sn3Ag0.5Cu solder and Cu–Co dual-phase substrate
出版年份 2018 全文链接
标题
Interfacial reaction and microstructure between the Sn3Ag0.5Cu solder and Cu–Co dual-phase substrate
作者
关键词
-
出版物
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
Volume 124, Issue 7, Pages -
出版商
Springer Nature
发表日期
2018-06-11
DOI
10.1007/s00339-018-1907-8
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates
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- Solid-state interfacial reactions of Sn and Sn–Ag–Cu solders with an electroless Co(P) layer deposited on a Cu substrate
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- Strong effects of minor Ga addition on liquid-state Sn–Ga/Co interfacial reactions
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- Interfacial reactions between Cu and SnAgCu solder doped with minor Ni
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- Effects of copper content and liquid separation on the microstructure formation of Co–Cu immiscible alloys
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- (2013) Q.Q. Lai et al. ACTA MATERIALIA
- Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging
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- Effects of Ti addition to Sn–Ag and Sn–Cu solders
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