Cu6Sn5 Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints

标题
Cu6Sn5 Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints
作者
关键词
-
出版物
JOURNAL OF ELECTRONIC MATERIALS
Volume 40, Issue 2, Pages 176-188
出版商
Springer Nature
发表日期
2010-12-07
DOI
10.1007/s11664-010-1430-y

向作者/读者发起求助以获取更多资源

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now