Design and Properties of New Lead-Free Solder Joints Using Sn-3.5Ag-Cu Solder

Indium, chromium and nickel-modified eutectic Sn–0.7 wt% Cu lead-free solder rapidly solidified from molten state

(2015) Rizk Mostafa Shalaby   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Whisker Formation on SAC305 Soldered Assemblies

(2014) S. Meschter et al.   JOM

Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate

(2012) J.F. Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys

(2012) Rizk Mostafa Shalaby   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte

(2012) Mui Chee Liew et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Indentation creep and mechanical properties of quaternary Sn–Sb based alloys

(2011) A. El-Bediwi et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Copper effects in mechanical properties of rapidly solidified Sn–Pb–Sb Babbitt bearing alloys

(2011) Mustafa Kamal et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of rapid solidification on mechanical properties of a lead free Sn–3.5Ag solder

(2010) R.M. Shalaby   JOURNAL OF ALLOYS AND COMPOUNDS

Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

(2010) L.C. Tsao   JOURNAL OF ALLOYS AND COMPOUNDS

Corrosion behaviour assessment of lead-free Sn–Ag–M (M=In, Bi, Cu) solder alloys

(2008) F. Rosalbino et al.   MATERIALS CHEMISTRY AND PHYSICS