Interfacial compounds growth of SnAgCu(nano La 2 O 3 )/Cu solder joints based on experiments and FEM

出版年份 2015 全文链接

标题

作者

关键词

Intermetallic compounds, Growth kinetic, Activated energy, Fatigue life

出版物

Volume 635, Issue -, Pages 55-60

出版商

Elsevier BV

发表日期

2015-02-20

DOI

10.1016/j.jallcom.2015.02.110

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