Contactless Thermal Boundary Resistance Measurement of GaN-on-Diamond Wafers

标题
Contactless Thermal Boundary Resistance Measurement of GaN-on-Diamond Wafers
作者
关键词
-
出版物
IEEE ELECTRON DEVICE LETTERS
Volume 35, Issue 10, Pages 1007-1009
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2014-09-17
DOI
10.1109/led.2014.2350075

向作者/读者发起求助以获取更多资源

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now