Electrospun Functional Materials toward Food Packaging Applications: A Review

标题
Electrospun Functional Materials toward Food Packaging Applications: A Review
作者
关键词
-
出版物
Nanomaterials
Volume 10, Issue 1, Pages 150
出版商
MDPI AG
发表日期
2020-01-15
DOI
10.3390/nano10010150

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