Study on microstructure and properties of Sn–0.3Ag–0.7Cu solder bearing Nd

Published 2016 View Full Article

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Title
Study on microstructure and properties of Sn–0.3Ag–0.7Cu solder bearing Nd
Authors
Keywords
Wettability, Solder Joint, Solder Matrix, Molten Solder, Ag3Sn Phase
Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 27, Issue 8, Pages 8771-8777
Publisher
Springer Nature
Online
2016-04-29
DOI
10.1007/s10854-016-4901-y
References
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