A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products

Published 2011 View Full Article

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Title
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 52, Issue 1, Pages 90-99
Publisher
Elsevier BV
Online
2011-09-01
DOI
10.1016/j.microrel.2011.07.093

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