Diffusion and reaction behavior of palladium coating and copper matrix prepared using a halogen-free direct coating process

Optimization of the Direct Diffusion Bonding Process Using Cu Stabilizing Layers of the REBCO Coated Conductors

(2023) Seishiro Kato et al.   IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY

Strengthening mechanism of ultra-high strength Cu–20Ag alloy wire induced by cumulative strain

(2022) Pengfei Zhang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

A High-Efficiency Searching Time Reduction Method for VCM Soft-Landing Operation During Chip Bonding

(2022) Lanyu Zhang et al.   IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS

Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires

(2019) HaoKun Yang et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

A Study of the Sulfidation Behavior on Palladium-Coated Copper Wire with a Flash-Gold Layer (PCA) after Wire Bonding

(2019) Chen et al.   Electronics

Fast rate oxidation to Cu2O, at room temperature, of metallic copper films produced by the argon-plasma bombardment of CuO films

(2019) M.A. Badillo-Ávila et al.   MATERIALS CHEMISTRY AND PHYSICS

High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes

(2018) C.E. Ho et al.   APPLIED SURFACE SCIENCE

Evaluation of Corrosion Resistance of Ag-Alloy Bonding Wires for Electronic Packaging

(2018) Chun-Hao Chen et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Control over fine scale terrace structures induced on polycrystalline Pd by simple heat treatments in air

(2017) J.M. Sobral et al.   SURFACE & COATINGS TECHNOLOGY

Nanoscale structure of submicron-thick sputter-deposited Pd films: Effect of the adatoms diffusivity by the film-substrate interaction

(2017) V. Torrisi et al.   SURFACE & COATINGS TECHNOLOGY

Impact of temperature-induced coalescence on SERS properties of Au nanoparticles deposited on GaN nano-columns

(2016) Igor Dzięcielewski et al.   APPLIED SURFACE SCIENCE

Nanoparticle shape, thermodynamics and kinetics

(2016) L D Marks et al.   JOURNAL OF PHYSICS-CONDENSED MATTER

Impact of partial recrystallization on the mechanical properties of severely deformed copper

(2016) Z. Abbasi et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Comparative study between Au/Pd/Cu and Au/Pd(P)/Cu films in soldering applications

(2016) P.T. Lee et al.   SURFACE & COATINGS TECHNOLOGY

The effect of Pd content on microstructure and shape-memory properties of Ti–Ni–Pd–Cu alloys

(2014) Masamine Imahashi et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Formic Acid-Assisted Synthesis of Palladium Nanocrystals and Their Electrocatalytic Properties

(2013) Qinchao Wang et al.   LANGMUIR

On the role of surface diffusion in determining the shape or morphology of noble-metal nanocrystals

(2013) X. Xia et al.   PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA

Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding

(2012) Hui Xu et al.   ACTA MATERIALIA

The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

(2012) Yu-Wei Lin et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Mechanical characterization of pristine and hydrogen-exposed palladium nanowires byin situTEM

(2012) Jennifer Carpena-Núñez et al.   NANOTECHNOLOGY

Texture-dependent twin formation in nanocrystalline thin Pd films

(2012) B. Wang et al.   SCRIPTA MATERIALIA

Revealing Extraordinary Intrinsic Tensile Plasticity in Gradient Nano-Grained Copper

(2011) T. H. Fang et al.   SCIENCE

Diffusion-induced recrystallization in the Cu(Pd) system at complete solid-solution temperatures

(2010) S. Inomata et al.   JOURNAL OF MATERIALS SCIENCE

New insights into the growth mechanism and surface structure of palladium nanocrystals

(2010) Byungkwon Lim et al.   Nano Research

Formation of ultra-fine copper grains in copper-clad aluminum wire

(2010) T.T. Sasaki et al.   SCRIPTA MATERIALIA

Evaluation of Pd-based brazes to join silicon nitride to copper-clad-molybdenum

(2009) R. Asthana et al.   CERAMICS INTERNATIONAL

Palladium diffusion into bulk copper via the (100) surface

(2009) E Bussmann et al.   JOURNAL OF PHYSICS-CONDENSED MATTER

Factors influencing the tensile strength, hardness, and ductility of hydrogen-cycled palladium

(2009) Erik Dillon et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Grain refinement and mechanical properties in ultrafine grained Pd and Pd–Ag alloys produced by HPT

(2009) L. Kurmanaeva et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING