Revealing Extraordinary Intrinsic Tensile Plasticity in Gradient Nano-Grained Copper

Interfacial diffusion in Cu with a gradient nanostructured surface layer

(2010) Z.B. Wang et al.   ACTA MATERIALIA

Failure by simultaneous grain growth, strain localization, and interface debonding in metal films on polymer substrates

(2009) Nanshu Lu et al.   JOURNAL OF MATERIALS RESEARCH

Experimental Observations of Stress-Driven Grain Boundary Migration

(2009) T. J. Rupert et al.   SCIENCE

In situ TEM observations of fast grain-boundary motion in stressed nanocrystalline aluminum films

(2008) Marc Legros et al.   ACTA MATERIALIA

Fabrication of a gradient nano-micro-structured surface layer on bulk copper by means of a surface mechanical grinding treatment

(2008) W.L. Li et al.   SCRIPTA MATERIALIA

Grain coarsening during compression of bulk nanocrystalline nickel and copper

(2007) S. Brandstetter et al.   SCRIPTA MATERIALIA