Optimization of the Direct Diffusion Bonding Process Using Cu Stabilizing Layers of the REBCO Coated Conductors

Title
Optimization of the Direct Diffusion Bonding Process Using Cu Stabilizing Layers of the REBCO Coated Conductors
Authors
Keywords
-
Journal
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2023-03-28
DOI
10.1109/tasc.2023.3261839

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