A High-Efficiency Searching Time Reduction Method for VCM Soft-Landing Operation During Chip Bonding

A novel rapid micromotion compensator for high-precision chip bonding manufacturing

(2021) Lanyu Zhang et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

A Rapid Dynamic Positioning Method for Settling Time Reduction Through a Macro–Micro Composite Stage With High Positioning Accuracy

(2018) Lanyu Zhang et al.   IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS

Study on dipping mathematical models for solder Flip-chip bonding in microelectronics packaging

(2018) Junhui Li et al.   IEEE Transactions on Industrial Informatics

High-Efficiency Revolving-Turret Chip Transferring Technology for Flip Chip Packaging

(2018) Jinhua Hong et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

In situ observation of ultrasonic flip-chip bonding using high-speed camera

(2015) Takanori Shuto et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Active vibration isolation of macro–micro motion stage disturbances using a floating stator platform

(2015) Lufan Zhang et al.   JOURNAL OF SOUND AND VIBRATION

High-Acceleration Precision Point-to-Point Motion Control With Look-Ahead Properties

(2010) Jianhua Wu et al.   IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS

A High-Precision Dual-Servo Stage Using Halbach Linear Active Magnetic Bearings

(2010) Young-Man Choi et al.   IEEE-ASME TRANSACTIONS ON MECHATRONICS

An impact force compensation algorithm based on a piezo force sensor for wire bonding processes

(2007) Jung-Han Kim et al.   CONTROL ENGINEERING PRACTICE