A new design rule for high entropy alloy diffusion barriers in Cu metallization

Refractory WMoNbVTa high-entropy alloy as a diffusion barrier between a molybdenum substrate and MoSi2 ceramic coating

(2022) Jianhui Yan et al.   CERAMICS INTERNATIONAL

Microstructure and mechanical properties of WNbMoTaZrx (x = 0.1, 0.3, 0.5, 1.0) refractory high entropy alloys

(2022) S.H. Chen et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Synthesis and structure of refractory high entropy alloy thin films based on the MoNbTaW system

(2022) Georg C. Gruber et al.   SURFACE & COATINGS TECHNOLOGY

Excellent diffusion barrier property of amorphous NbMoTaW medium entropy alloy thin films used in Cu/Si Connect System

(2022) K. Hu et al.   VACUUM

High Hardness and Wear Resistance in AlCrFeNiV High-Entropy Alloy Induced by Dual-Phase Body-Centered Cubic Coupling Effects

(2022) Cong Feng et al.   Materials

A low-density high-entropy dual-phase alloy with hierarchical structure and exceptional specific yield strength

(2022) Yasong Li et al.   Science China-Materials

Al0.25CoCrFeNiSi0.6 high entropy alloy with high hardness and improved wear resistance

(2022) Olga Samoilova et al.   MATERIALS LETTERS

Thermal stability of MoNbTaTiW, MoNbTaVW and CrMoNbTaW thin films deposited by high power impulse magnetron sputtering

(2022) Georg C. Gruber et al.   SURFACE & COATINGS TECHNOLOGY

Study on the microstructural evolution in NbMoTaW series refractory multi-principal element alloy films by low-energy and high-flux He ions irradiation

(2022) Yuting Guo et al.   SURFACE & COATINGS TECHNOLOGY

Enhanced diffusion barrier property of nanolayered NbMoTaW/TiVCr high entropy alloy for copper metallization

(2021) P.F. Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Diffusion Barrier Performance of AlCrTaTiZr/AlCrTaTiZr-N High-Entropy Alloy Films for Cu/Si Connect System

(2020) Chunxia Jiang et al.   Entropy

Applications of High Diffusion Resistance Multi‐component AlCrTaTiZrRu/(AlCrTaTiZrRu)N 0.7 Film in Cu Interconnects

(2020) Rongbin Li et al.   ADVANCED ENGINEERING MATERIALS

Thermodynamic route for self-forming 1.5 nm V-Nb-Mo-Ta-W high-entropy alloy barrier layer: Roles of enthalpy and mixing entropy

(2020) Yu-Ting Hsiao et al.   ACTA MATERIALIA

Thermal Stability of MoNbTaVW High Entropy Alloy Thin Films

(2020) Ao Xia et al.   Coatings

Multi-component AlCrTaTiZrMo-nitride film with high diffusion resistance in copper metallization

(2018) Rongbin Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of high entropy alloys TiVCrZrHf barrier layer on microstructure and texture of Cu thin films

(2018) Xiaowen Peng et al.   MATERIALS LETTERS

Microstructure and physical properties of sputter-deposited Cu-Mo thin films

(2018) Imane Souli et al.   THIN SOLID FILMS

Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si(001) wafers and Cu overlayers

(2018) Marlene Mühlbacher et al.   Scientific Reports

Thermal stability of AlCrTaTiZrMo-nitride high entropy film as a diffusion barrier for Cu metallization

(2018) Rongbin Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Ti additions on mechanical properties of NbMoTaW and VNbMoTaW refractory high entropy alloys

(2017) Z.D. Han et al.   INTERMETALLICS

Cu diffusion in single-crystal and polycrystalline TiN barrier layers: A high-resolution experimental study supported by first-principles calculations

(2015) Marlene Mühlbacher et al.   JOURNAL OF APPLIED PHYSICS

Comparison of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti

(2014) M. Fugger et al.   MICROELECTRONICS RELIABILITY

Structural and Thermodynamic Factors of Suppressed Interdiffusion Kinetics in Multi-component High-entropy Materials

(2014) Shou-Yi Chang et al.   Scientific Reports

Resistivity-microstructure correlation of self-annealed electrodeposited copper thin films

(2012) N. Alshwawreh et al.   MICROELECTRONIC ENGINEERING

Phase stability in high entropy alloys: Formation of solid-solution phase or amorphous phase

(2012) Sheng GUO et al.   Progress in Natural Science-Materials International

Thermally Stable TiVCrZrHf Nitride Films as Diffusion Barriers in Copper Metallization

(2011) Shih-Chang Liang et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Mechanical properties of Nb25Mo25Ta25W25 and V20Nb20Mo20Ta20W20 refractory high entropy alloys

(2011) O.N. Senkov et al.   INTERMETALLICS

4-nm thick multilayer structure of multi-component (AlCrRuTaTiZr)Nx as robust diffusion barrier for Cu interconnects

(2011) Shou-Yi Chang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

5 nm-Thick (AlCrTaTiZrRu)N0.5 Multi-Component Barrier Layer with High Diffusion Resistance for Cu Interconnects

(2011) Shou-Yi Chang et al.   Nanoscience and Nanotechnology Letters

Ru incorporation on marked enhancement of diffusion resistance of multi-component alloy barrier layers

(2010) Shou-Yi Chang et al.   JOURNAL OF ALLOYS AND COMPOUNDS