Journal
IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS
Volume 14, Issue 11, Pages 4746-4754Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TII.2018.2805297
Keywords
Curve fitting; dipping mathematical model; flip chip; image processing; microelectronics packaging
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Funding
- China High Technology RD Program 973 [2015CB057206]
- Discovery Project of State Key Laboratory of High Performance Complex Manufacturing [ZZYJKT2016-11]
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In order to develop the flux dipping process, a quantitative mathematical model that accurately describes the flux dipping process in the flip-chip bonding is proposed. The whole dynamic dipping process is captured by the high-speed transient imaging followed by image processing. Curve fitting of experimental results yields the relation between flux dipping quantity and process parameters. It suggests a quadratic function of quantity (Q) with respect to dipping depth (d), and a piece-wise function to dipping speed (v) including an exponential section and a quadratic or linear section. While the coupled effect of d and v can be expressed as a merged function of Q = f((d,v)), these mathematical models are proved to be effective when applied to the actual dipping process practiced on a flip-chip bonding machine, thus providing a reliable mathematical basis for optimizing dipping flux in industrial manufacturing.
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