Journal
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume 8, Issue 1, Pages 154-164Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2017.2760342
Keywords
Flip chip packaging; microelectronic packaging; revolving-turret chip transferring (RTCT)
Categories
Funding
- National Natural Science Foundation of China [51475195, 51635007]
- National Science and Technology Support Program [2015BAF11B02]
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With the rapid growth of the microelectronic packaging market, it is necessary to increase the throughput and reduce the cost of flip chip. Driven by these evolutions, a novel revolving-turret chip transferring (RTCT) technology is introduced to implement high-throughput flip chip packaging. The unnecessary time delays of packaging processes could be eliminated in the RTCT technology due to its parallel manner of motions. In order to analyze the packaging efficiency, the layout and movement sequence of the packaging system are studied, and a calculation model of packaging efficiency is proposed. Furthermore, the effects of the critical parameters (the horizontal and the vertical spacing of antennas and the maximum velocity and acceleration of the turret-type head) on packaging efficiency are investigated to search out the optimal parameters combination. To verify the performance of the RTCT technology under optimal parameters combination, two cases are implemented and compared. The results show that due to parallel motions of processes, unnecessary delays affecting the packaging efficiency have been reduced, and the packaging efficiency of ALN-9714 inlay could be more than 35k chips per hour. In addition, compared with the conventional flip chip packaging process, the RTCT technology is more effective in packaging the chips on antennas with multicolumn layout and small horizontal spacing.
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