A novel rapid micromotion compensator for high-precision chip bonding manufacturing
Published 2021 View Full Article
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Title
A novel rapid micromotion compensator for high-precision chip bonding manufacturing
Authors
Keywords
Micromotion structure, Piezoelectric actuator, Precision positioning, Dynamic model, Force analysis
Journal
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
Volume 71, Issue -, Pages 282-292
Publisher
Elsevier BV
Online
2021-03-28
DOI
10.1016/j.precisioneng.2021.03.013
References
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- (2016) Jing Xiao et al. IEEE Transactions on Components Packaging and Manufacturing Technology
- Multi-objective optimization design of a connection frame in macro–micro motion platform
- (2015) Lufan Zhang et al. APPLIED SOFT COMPUTING
- In situ observation of ultrasonic flip-chip bonding using high-speed camera
- (2015) Takanori Shuto et al. JAPANESE JOURNAL OF APPLIED PHYSICS
- Active vibration isolation of macro–micro motion stage disturbances using a floating stator platform
- (2015) Lufan Zhang et al. JOURNAL OF SOUND AND VIBRATION
- Precision positioning device using the combined piezo-VCM actuator with frictional constraint
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- Development of a PC-based control system for a five-axis ultraprecision micromilling machine ‘Ultra-Mill’ and its performance assessment
- (2010) M K M Nor et al. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE
- Dynamics of Ultrasonic Transducer System for Thermosonic Flip Chip Bonding
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- A holistic integrated dynamic design and modelling approach applied to the development of ultraprecision micro-milling machines
- (2009) Dehong Huo et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Model reference adaptive control for a piezo-positioning system
- (2009) Yung-Tien Liu et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
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