Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages

Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging

(2022) Meng-Kai Shih et al.   MICROELECTRONICS RELIABILITY

A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow

(2020) Jing Wang et al.   MICROELECTRONICS RELIABILITY

Study on Delamination Between Polymer Materials and Metals in IC Packaging Process

(2019) Cheng-Tang Pan et al.   Polymers

Experimental determination of critical adhesion energies with the Advanced Button Shear Test

(2019) Nadine Pflügler et al.   MICROELECTRONICS RELIABILITY

A fatigue crack propagation model with resistance curve effects for an epoxy/copper interface

(2017) David Samet et al.   ENGINEERING FRACTURE MECHANICS

Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages

(2016) Kenny Mahan et al.   MICROELECTRONICS RELIABILITY

Experiments for Obtaining Cohesive-Zone Parameters for Copper-Mold Compound Interfacial Delamination

(2016) William E. R. Krieger et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Experiments and Three-Dimensional Modeling of Delamination in an Encapsulated Microelectronic Package Under Thermal Loading

(2013) Siow Ling Ho et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Delamination R-curve as a material property of unidirectional glass/epoxy composites

(2011) M.M. Shokrieh et al.   MATERIALS & DESIGN