Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging

Copper Trace Fatigue Life Modeling for Rigid Electronic Assemblies

(2021) Sandeep Menon et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Semi-empirical law for fatigue resistance of redistribution layers in chip-scale packages

(2021) M. van Soestbergen et al.   MICROELECTRONICS RELIABILITY

van der Waals epitaxy of monolayer hexagonal boron nitride on copper foil: growth, crystallography and electronic band structure

(2015) Grace E Wood et al.   2D Materials

Experimental and Simulation Study of Double-Sided Flip-Chip Assembly With a Stiffener Ring

(2013) Xi Liu et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs

(2010) D. Farley et al.   MICROELECTRONICS RELIABILITY

Investigation of the Trace Line Failure Mechanism and Design of Flexible Wafer Level Packaging

(2009) Ming-Chih Yew et al.   IEEE TRANSACTIONS ON ADVANCED PACKAGING

Warpage Analysis of Flip-Chip PBGA Packages Subject to Thermal Loading

(2009) Ming-Yi Tsai et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY