Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages

Published 2016 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages
Authors
Keywords
Adhesion strength, Single cantilever adhesion test, Energy release rate, J-integral, EMC, Epoxy molding compound, Photo solder resist, PSR
Journal
MICROELECTRONICS RELIABILITY
Volume 63, Issue -, Pages 134-141
Publisher
Elsevier BV
Online
2016-06-30
DOI
10.1016/j.microrel.2016.05.015

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.