Study on Delamination Between Polymer Materials and Metals in IC Packaging Process

Published 2019 View Full Article

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Title
Study on Delamination Between Polymer Materials and Metals in IC Packaging Process
Authors
Keywords
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Journal
Polymers
Volume 11, Issue 6, Pages 940
Publisher
MDPI AG
Online
2019-05-30
DOI
10.3390/polym11060940
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