Simulation of abrasive polishing process of single crystal silicon based on molecular dynamics

Phosphorus implantation into 4H-SiC at room and elevated temperature

(2021) J Müting et al.   SEMICONDUCTOR SCIENCE AND TECHNOLOGY

The Size Effects of Point Defect on the Mechanical Properties of Monocrystalline Silicon: A Molecular Dynamics Study

(2021) Wei Wan et al.   Materials

Molecular dynamics simulation of ultra-precision machining 3C-SiC assisted by ion implantation

(2021) Houfu Dai et al.   Journal of Manufacturing Processes

Effect of nanoparticles in molten salts – MD simulations and experimental study

(2020) Adela Svobodova-Sedlackova et al.   RENEWABLE ENERGY

Numerical and experimental investigation on ductile deformation and subsurface defects of monocrystalline silicon during nano-scratching

(2020) Bing Liu et al.   APPLIED SURFACE SCIENCE

Study on the surface damage mechanism of monocrystalline silicon in micro ball-end milling

(2019) Minghui Yang et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Molecular dynamics simulation of SiC removal mechanism in a fixed abrasive polishing process

(2019) Piao Zhou et al.   CERAMICS INTERNATIONAL

Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

(2019) Jianyun Shen et al.   Micromachines

Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale

(2018) Binbin Meng et al.   CERAMICS INTERNATIONAL

Investigation of machining mechanism of monocrystalline silicon in nanometric grinding

(2017) Liping He et al.   AIP Advances

Nanodicing Single Crystalline Silicon Nanowire Arrays

(2016) Alon Kosloff et al.   NANO LETTERS

Microcracks in Silicon Wafers I: Inline Detection and Implications of Crack Morphology on Wafer Strength

(2016) Matthias Demant et al.   IEEE Journal of Photovoltaics

Effect of stacking fault in silicon induced by nanoindentation with MD simulation

(2015) Xiaoguang Guo et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Effect of texturing process involving saw-damage etching on crystalline silicon solar cells

(2013) Hyunho Kim et al.   APPLIED SURFACE SCIENCE

Nanogrinding of SiC wafers with high flatness and low subsurface damage

(2013) Feng-wei HUO et al.   TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA

A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials

(2012) Muhammad Arif et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Force modeling of microscale grinding process incorporating thermal effects

(2008) Hyung Wook Park et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Deformation pathway to high-pressure phases of silicon during nanoindentation

(2008) Dong Earn Kim et al.   JOURNAL OF APPLIED PHYSICS

Contact and friction analysis at tool-chip interface to high-speed machining

(2008) J. Brocail et al.   International Journal of Material Forming