Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale

Published 2018 View Full Article

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Title
Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale
Authors
Keywords
SiC, Coupling effect, Deformation, Molecular dynamics
Journal
CERAMICS INTERNATIONAL
Volume 45, Issue 2, Pages 2483-2491
Publisher
Elsevier BV
Online
2018-10-21
DOI
10.1016/j.ceramint.2018.10.175

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