The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers
Published 2022 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers
Authors
Keywords
Wafer self-rotational grinding, Surface topography model, Plastic side flow, Elastic spring back, Brittle fracture
Journal
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
Volume 222, Issue -, Pages 107240
Publisher
Elsevier BV
Online
2022-04-07
DOI
10.1016/j.ijmecsci.2022.107240
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Effect of grinding residual height on the surface shape of ground wafer
- (2021) Weihua Yao et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters
- (2021) Yu Zhang et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
- Research on the shape of ground wafer in Back Grinding of Wafer with Outer Rim
- (2021) Xiaoguang Guo et al. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
- A Feeding-Directional Cutting Force Model for End Surface Grinding of CFRP Composites using Rotary Ultrasonic Machining with Elliptical Ultrasonic Vibration
- (2020) Hui Wang et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Three-dimensional modeling and theoretical investigation of grinding marks on the surface in small ball-end diamond wheel grinding
- (2020) Tingzhang Wang et al. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
- A mechanistic cutting force model based on ductile and brittle fracture material removal modes for edge surface grinding of CFRP composites using rotary ultrasonic machining
- (2020) Hui Wang et al. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
- Elastic recovery of monocrystalline silicon during ultra-fine rotational grinding
- (2020) Ning Huang et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
- Study into grinding force in back grinding of wafer with outer rim
- (2020) Xiang-Long Zhu et al. Advances in Manufacturing
- Study on surface generation mechanism and roughness distribution in gear profile grinding
- (2020) Weihua Zhou et al. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
- Investigation of material flow behaviour and chip formation mechanism during grinding of glass-ceramics by nanoscratch
- (2019) Xue Yang et al. CERAMICS INTERNATIONAL
- Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process
- (2019) Lixiang Zhang et al. CURRENT APPLIED PHYSICS
- Surface roughness prediction model of SiCp/Al composite in grinding
- (2019) Chuanmin Zhu et al. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
- Experimental analysis of ductile-brittle transitions for parallel and intersecting micro-slot grinding in BK-7 glass
- (2019) Ashwani Pratap et al. CERAMICS INTERNATIONAL
- Theoretical and experimental investigation of material removal mechanism in compliant shape adaptive grinding process
- (2019) Wu-Le Zhu et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Analytical modeling of surface roughness in precision grinding of particle reinforced metal matrix composites considering nanomechanical response of material
- (2019) Zhenzhong Zhang et al. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
- Elastic–plastic deformation of single-crystal silicon in nano-cutting by a single-tip tool
- (2019) Ning Huang et al. JAPANESE JOURNAL OF APPLIED PHYSICS
- Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal
- (2019) Yufei Gao et al. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
- Research on predicting model of surface roughness in small-scale grinding of brittle materials considering grinding tool topography
- (2019) Jun Wu et al. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
- An investigation of the surface waviness features of ground surface in parallel grinding process
- (2019) Yongcheng Pan et al. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
- Experiment and theoretical prediction for surface roughness of PV polycrystalline silicon wafer in electroplated diamond wire sawing
- (2019) Xinying Li et al. Journal of Manufacturing Processes
- Hardness and friction coefficient of fused silica under scratching considering elastic recovery
- (2019) Xudong Fang et al. CERAMICS INTERNATIONAL
- An experimental and theoretical analysis of surface generation in the ultra-precision grinding of hard and brittle materials
- (2018) Shan Shan Chen et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- A new diamond machining approach for extendable fabrication of micro-freeform lens array
- (2018) Wu-Le Zhu et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- A comprehensive investigation of plowing and grain-workpiece micro interactions on 3D ground surface topography
- (2018) Weihua Zhou et al. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
- A new approach to modeling the surface topography in grinding considering ploughing action
- (2018) Hai Feng Chen et al. MACHINING SCIENCE AND TECHNOLOGY
- Three-dimensional modelling and simulation of vibration marks on surface generation in ultra-precision grinding
- (2018) Shanshan Chen et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
- Modelling and experimental study of roughness in silicon wafer self-rotating grinding
- (2018) Jinglong Sun et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
- Influence of strain rate effect on material removal and deformation mechanism based on ductile nanoscratch tests of Lu2O3 single crystal
- (2018) Chen Li et al. CERAMICS INTERNATIONAL
- Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer
- (2018) Bin Lin et al. JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME
- Study on ductile mode machining of single-crystal silicon by mechanical machining
- (2017) Dae-Hee Choi et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Grinding performance of textured monolayer CBN wheels: Undeformed chip thickness nonuniformity modeling and ground surface topography prediction
- (2017) Wenfeng Ding et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Surface roughness of two-frequency elliptical vibration texturing (TFEVT) method for micro-dimple pattern process
- (2017) Rendi Kurniawan et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Surface roughness modeling for grinding of Silicon Carbide ceramics considering co-existence of brittleness and ductility
- (2017) Chongjun Wu et al. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
- Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing
- (2017) Tengyun Liu et al. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
- Theoretical analysis on effects of grain size variation
- (2017) Libo Zhou et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
- Analytical modeling of grinding-induced subsurface damage in monocrystalline silicon
- (2017) Hao Nan Li et al. MATERIALS & DESIGN
- Origins for the size effect of surface roughness in diamond turning
- (2016) C.L. He et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- A predictive model of grinding force in silicon wafer self-rotating grinding
- (2016) Jinglong Sun et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Modeling and experimental study on micro-fracture behavior and restraining technology in micro-grinding of glass
- (2014) Jun Cheng et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- On the influence of single grit micro-geometry on grinding behavior of ductile and brittle materials
- (2013) D. Axinte et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Investigation of different grain shapes and dressing to predict surface roughness in grinding using kinematic simulations
- (2013) Yueming Liu et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
- Strain-hardening in submicron silicon pillars and spheres
- (2012) Douglas D. Stauffer et al. ACTA MATERIALIA
- Experimental investigation of material removal mechanism in single grit grinding
- (2012) Tahsin Tecelli Öpöz et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials
- (2012) Muhammad Arif et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Grinding characteristics in high speed grinding of engineering ceramics with brazed diamond wheels
- (2010) Jianyi Chen et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- Grinding of silicon wafers: A review from historical perspectives
- (2008) Z.J. Pei et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Modelling and analysis of micro scale milling considering size effect, micro cutter edge radius and minimum chip thickness
- (2007) Xinmin Lai et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- A process model of wafer thinning by diamond grinding
- (2007) Chao-Chang A. Chen et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Publish scientific posters with Peeref
Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.
Learn MoreAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started