A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters
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Title
A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters
Authors
Keywords
Grit cutting depth, Analytic model, Grit deflection, Surface roughness, Brittle and hard materials
Journal
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
Volume 72, Issue -, Pages 461-468
Publisher
Elsevier BV
Online
2021-06-23
DOI
10.1016/j.precisioneng.2021.06.007
References
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