Effect of grinding residual height on the surface shape of ground wafer

Published 2021 View Full Article

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Title
Effect of grinding residual height on the surface shape of ground wafer
Authors
Keywords
Silicon wafer, Residual height, Grinding marks, Wafer shape, Model
Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 299, Issue -, Pages 117390
Publisher
Elsevier BV
Online
2021-10-08
DOI
10.1016/j.jmatprotec.2021.117390
References
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