Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer

Detailed Analysis and Description of Grinding Wheel Topographies

(2017) Markus Weiß et al.   JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME

Grinding Energy Modeling Based on Friction, Plowing, and Shearing

(2017) Barbara S. Linke et al.   JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME

Theoretical analysis on effects of grain size variation

(2017) Libo Zhou et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

A grinding force model for ultrasonic assisted internal grinding (UAIG) of SiC ceramics

(2015) Jianguo Cao et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

2D/3D ground surface topography modeling considering dressing and wear effects in grinding process

(2013) J.L. Jiang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Magnetorheological elastic super-smooth finishing for high-efficiency manufacturing of ultraviolet laser resistant optics

(2013) Feng Shi et al.   OPTICAL ENGINEERING

Analysis of ductile mode and brittle transition of AFM nanomachining of silicon

(2012) Seoung Hwan Lee   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

A novel model for undeformed nanometer chips of soft-brittle HgCdTe films induced by ultrafine diamond grits

(2012) Zhenyu Zhang et al.   SCRIPTA MATERIALIA

Nanoscale Material Removal Mechanism of Soft-Brittle HgCdTe Single Crystals Under Nanogrinding by Ultrafine Diamond Grits

(2012) Zhenyu Zhang et al.   TRIBOLOGY LETTERS

Characterization of the transition from ploughing to cutting in micro machining and evaluation of the minimum thickness of cut

(2011) A. Cuba Ramos et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

A study on the diamond grinding of ultra-thin silicon wafers

(2011) L Zhou et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE

Ultra-precision grinding

(2010) E. Brinksmeier et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Modeling and prediction of surface roughness in ceramic grinding

(2010) Sanjay Agarwal et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Grinding of silicon wafers: A review from historical perspectives

(2008) Z.J. Pei et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Characteristics of silicon substrates fabricated using nanogrinding and chemo-mechanical-grinding

(2007) H. Huang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING